Today’s high density computing uses powerful processors, leading to more electrical power in each rack of computers. That creates a challenge: heat.
Getting rid of that heat has become a key limitation on innovation and technological progress. But, there is a solution that can support today’s requirements while saving space and energy.
Direct-on-chip, two-phase, waterless liquid cooling — or 2PLC — can now be integrated into racks and data centers seamlessly and painlessly.
Rittal High Density Cooled-by-ZutaCore is a whitepaper that explains the details of implementing this effective, low-maintenance solution.