Meet Rittal at the 2026 OCP Global Summit

    October 12–15, 2026 | San Jose Convention Center | Booth C3

    Explore a coordinated approach to infrastructure for high-density AI and high-performance computing. See how Rittal brings rack platforms, power distribution, and liquid cooling together to support the demands of today’s compute environments and plans for future growth.

    AI Infrastructure Starts with a Coordinated System

    Increasing AI density places new demands on rack power, heat removal, and liquid distribution. Meeting those demands requires infrastructure designed to work together.

    At the 2026 OCP Global Summit, Rittal will showcase RiMatrix HPC, a system approach that combines racks, power distribution, and liquid cooling for high-density AI and HPC deployments. Explore OCP-based infrastructure and architectures supporting NVIDIA platforms, with building blocks that address requirements from individual racks to multi-megawatt deployment concepts.

    Visit booth C3 to explore the exhibits and discuss your application with our team.

    Rittal rack infrastructure for AI and HPC

    Rack Infrastructure for AI and HPC

    Explore rack platforms supporting NVIDIA MGX and OCP Open Rack v3 architectures. Discover how rack design accommodates high-density compute equipment while providing for the integration of cooling manifolds and power distribution components.

    Rittal 800 VDC Sidecar development concept

    Power Distribution for Higher Compute Density

    Preview Rittal’s 800 VDC Sidecar development concept, designed to provide a modular power foundation for high-density AI infrastructure. Explore an approach that creates more space for compute hardware while addressing power capacity, expansion, and serviceability.

    Rittal liquid cooling infrastructure for AI deployments

    Liquid Cooling from Rack to Row

    Explore in-rack and modular in-row coolant distribution units, rear-door heat removal, and liquid distribution infrastructure. See how these components address coolant control, residual rack heat, and the cooling requirements of high-density AI deployments.

    The showcase includes products with planned delivery dates and development concepts. Talk with our team about availability and suitability for your application.

    See How the Building Blocks Connect

    Power and cooling requirements extend beyond an individual rack. Rittal’s showcase connects rack infrastructure, power distribution, coolant distribution units, and Technology Cooling System piping into one coordinated infrastructure approach.

    Explore how these building blocks address:

    • Rack integration: Bringing compute equipment, cooling manifolds, and power components into a coordinated architecture.
    • Heat removal: Managing direct liquid cooling alongside the remaining air-side heat load.
    • Scalability: Using modular infrastructure to address growth from rack-level applications to larger AI deployments.
    • Serviceability: Incorporating redundancy and hot-swappable components where supported by the system design.

    Whether you are designing a new deployment or evaluating infrastructure for your next phase of growth, bring your requirements to the Rittal team at booth C3.

    Let’s Discuss Your AI Infrastructure Requirements

    Schedule a meeting with Rittal at the 2026 OCP Global Summit to discuss your rack, power distribution, and liquid cooling needs.

    Tell us about your application, deployment plans, and the challenges you want to address. Our team can walk you through the showcase and discuss which infrastructure building blocks may fit your requirements.